Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/132248
Kind Code:
A1
Abstract:
A printed wiring board according to the present invention comprises: a substrate that has a principal surface; a conductive pattern that is provided on the principal surface; and a plating layer. A through hole is formed in the substrate as traversing the substrate in the thickness direction. The thickness of the substrate is at least 0.5 mm. The plating layer is provided at least on the inner wall surface of the through hole and is electrically connected to a portion of the conductive pattern that surrounds the through hole. The thickness of the plating layer at the inner wall surface of the through hole is greater than the thickness of the conductive pattern and is at least 10 μm.
Inventors:
TAKAHASHI KENJI (JP)
SAKAI SHOICHIRO (JP)
KIYA SATOSHI (JP)
SAKAI SHOICHIRO (JP)
KIYA SATOSHI (JP)
Application Number:
PCT/JP2022/047159
Publication Date:
July 13, 2023
Filing Date:
December 21, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/42; H05K1/03
Foreign References:
| JPS5613796A | 1981-02-10 | |||
| JP2004335704A | 2004-11-25 | |||
| JP2007266606A | 2007-10-11 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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