Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/243500
Kind Code:
A1
Abstract:
This printed wiring board comprises a base film that has a main surface, and a conductive pattern that is disposed on the main surface. The conductive pattern has a base conductive layer that is disposed directly or indirectly on the main surface, and an electrolytic copper plating layer that is disposed on the base conductive layer. At the interface between the base conductive layer and the electrolytic copper plating layer, the void density, which is the value of the total surface area of voids within the range of a prescribed observation length divided by the observation length, is greater than 0.01μm2/μm and not more than 5.5μm2/μm. The value of T×VL/L within the observation length is 0.39 or less, where T is the thickness (μm) of the base conductive layer, L is the observation length (μm) at the interface and VL is the total length (μm) of voids existing at the interface within the range of the observation length.
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Inventors:
FUKAYA YOSUKE (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
HIDANI TAKUTO (JP)
YAMAGUCHI YOSHIHITO (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
HIDANI TAKUTO (JP)
YAMAGUCHI YOSHIHITO (JP)
Application Number:
PCT/JP2023/021104
Publication Date:
December 21, 2023
Filing Date:
June 07, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/18
Foreign References:
| JP2019197851A | 2019-11-14 | |||
| JP2019075456A | 2019-05-16 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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