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Patent Searching and Data


Title:
PRINTER
Document Type and Number:
WIPO Patent Application WO/2014/033860
Kind Code:
A1
Abstract:
In the present invention, a solder loading/unloading device (30) is attached to a printer (10) that prints cream solder (B) onto a printed substrate (A) by means of a squeegee unit (20) having a squeegee (24) being caused to progress/retreat in one direction at the top surface of a mask (13) below which a printing substrate (A) has been disposed and a cream solder (B) being moved. The solder loading/unloading device (30) is attached to a position separated in the direction of progress/retreat from the position at which the squeegee (24) is disposed in the squeegee unit (20). Also, the solder loading/unloading device (30) is configured from: a sheet (C) that loads the cream solder (B); a pressing roller (39) that is rotated manually; a following roller (37) that sandwiches the sheet (C) with the pressing roller (39) and causes the sheet (C) to progress/retreat; and a drive roller (34) that sandwiches the sheet (C) with the following roller (37) and causes the sheet (C) to progress/retreat.

Inventors:
HAYANO HITOSHI (JP)
MORITA MITSUHARU (JP)
Application Number:
PCT/JP2012/071879
Publication Date:
March 06, 2014
Filing Date:
August 29, 2012
Export Citation:
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Assignee:
YAMAHA MOTOR CO LTD (JP)
HAYANO HITOSHI (JP)
MORITA MITSUHARU (JP)
International Classes:
B41F15/40; B41F15/08; B65G35/04; B65G47/90; H05K3/34
Foreign References:
JPH06262750A1994-09-20
JPH03256743A1991-11-15
JP2002503161A2002-01-29
JPH05193106A1993-08-03
JPS6071414A1985-04-23
Attorney, Agent or Firm:
PROSPEC PATENT FIRM (JP)
Patent business corporation Pros Peck patent firm (JP)
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