Title:
PRINTING METHOD, AND METHOD FOR MANUFACTURING HOLE-FILLED BOARD AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/196770
Kind Code:
A1
Abstract:
This printing method includes: a placement step for placing a mask in which a hollow opening section is formed on a support substrate having a plurality of through holes formed therein, such that the single opening section is in communication with two or more of the through holes; a supply step for supplying a resin composition to a surface of the mask on the reverse side from the support substrate; a first printing step for filling the resin composition in the through holes by moving a first squeegee on the surface of the mask and relatively along said surface such that the first squeegee is partially pressed into the opening section; and a second printing step for applying a resin composition upon the resin composition that has been filled in the through holes by moving a second squeegee on the surface of the mask and relatively along said surface.
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Inventors:
TANAKA TAKAYUKI (JP)
HOMMA TATSUYA (JP)
HOMMA TATSUYA (JP)
Application Number:
PCT/JP2020/013738
Publication Date:
October 01, 2020
Filing Date:
March 26, 2020
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
B41M1/30; B41F15/08; B41F15/44; B41M1/12; B41N1/24; H05K1/16
Foreign References:
| JP2002158441A | 2002-05-31 | |||
| JP2002164649A | 2002-06-07 | |||
| JP2002368390A | 2002-12-20 | |||
| JP2012023373A | 2012-02-02 | |||
| JP2017171974A | 2017-09-28 | |||
| US20100315191A1 | 2010-12-16 | |||
| JP2017183327A | 2017-10-05 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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