Title:
PROBE CARD SUBSTRATE CONNECTION BASE
Document Type and Number:
WIPO Patent Application WO/2023/112315
Kind Code:
A1
Abstract:
There is a need to increase the connection strength of a base body (9) of a connection device (6) for connecting a plurality of plate-like members stacked on one another. A probe card substrate connection base (100) is characterized by comprising: an adhesive surface (91) set on a predetermined surface of the base body (9) that is adhered to a substrate (3); an adhesive containing chamber (93) that is provided inside the base body (9), has an opening (94) in the adhesive surface (91), and contains an adhesive (8); and a relief hole (95) that is provided in the adhesive containing chamber (93), opens in an opposite direction to the adhesive surface (91), and allows the adhesive (8) to be discharged therethrough.
Inventors:
MORI CHIKAOMI (JP)
HASAKA MASATOSHI (JP)
HASAKA MASATOSHI (JP)
Application Number:
PCT/JP2021/046781
Publication Date:
June 22, 2023
Filing Date:
December 17, 2021
Export Citation:
Assignee:
JAPAN ELECTRONIC MAT CORPORATION (JP)
International Classes:
G01R1/073
Domestic Patent References:
| WO2015015224A1 | 2015-02-05 |
Foreign References:
| JP2011154017A | 2011-08-11 | |||
| JPS5030159U | 1975-04-04 | |||
| JP2011141263A | 2011-07-21 | |||
| JP2013167461A | 2013-08-29 | |||
| US20100237887A1 | 2010-09-23 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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