Title:
PROBE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/100708
Kind Code:
A1
Abstract:
This probe substrate 17 is used in a probe card 11. The probe card 11 is provided with a main substrate part 12 having a circuit substrate 12a, and a support member 14 connected to the main substrate part 12. The probe substrate 17 comprises a probe substrate body 13 having a first main surface S2a positioned so as to face a first main surface S1a of the circuit substrate 12a, and a stress relaxation film 18 that is provided to the first main surface S2a of the probe substrate body 13 and is bonded to the support member 14.
Inventors:
YAMAGUCHI TAKAHISA (JP)
Application Number:
PCT/JP2022/043016
Publication Date:
June 08, 2023
Filing Date:
November 21, 2022
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
G01R1/073; G01R1/06; G01R31/26
Domestic Patent References:
| WO2021024918A1 | 2021-02-11 |
Foreign References:
| JP2020112487A | 2020-07-27 | |||
| JP2009281962A | 2009-12-03 | |||
| JP2011095254A | 2011-05-12 | |||
| JP2013056784A | 2013-03-28 | |||
| JP2006256956A | 2006-09-28 | |||
| JP2010114470A | 2010-05-20 | |||
| US20190064219A1 | 2019-02-28 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
Download PDF: