Title:
PROBER AND PROBER OPERATION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/170393
Kind Code:
A1
Abstract:
Provided is a prober and a prober operation method for preventing collision between a probe and a probe position detection camera. The prober 10 for performing inspection by causing a probe 25 to contact an electrode of a wafer W is provided with: a probe position detection camera 18 which detects a tip-end position of the probe 25 for relative positioning of the electrode of the wafer W and the probe 25; a probe height detector 20 which is provided separately from the probe position detection camera 18 and which detects the height of a tip-end of the probe from a reference surface serving as a reference for the height of the probe position detection camera 18; and a first height adjustment mechanism 21 which changes the height of the probe position detection camera 18 from the reference surface on the basis of the result of detection by the probe height detector 20.
Inventors:
MORI TOSHIRO (JP)
NISHIDA TOMOYA (JP)
NISHIDA TOMOYA (JP)
Application Number:
PCT/JP2017/012377
Publication Date:
October 05, 2017
Filing Date:
March 27, 2017
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
H01L21/66; G01R31/28
Foreign References:
| JP2013179329A | 2013-09-09 | |||
| JPH0721919A | 1995-01-24 | |||
| JP2009204492A | 2009-09-10 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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