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Patent Searching and Data


Title:
PROBER
Document Type and Number:
WIPO Patent Application WO/2016/159156
Kind Code:
A1
Abstract:
Provided is a prober with which it is possible to maintain parallelism between a probe card and a wafer and to perform a wafer level inspection to a high degree of accuracy. A test head 54 is held on a test head holding part 80. The test head 54 and a probe card 56 are securely held by suction to a pogo frame 58 attached to a head stage 52. A wafer chuck 50 moves toward the probe card 56 while detachably fixed to a Z-axis moving and rotating unit 72. The pressure in a sealed space formed between the wafer chuck 50 and the probe card 56 is reduced by a pressure reduction means. The wafer chuck 50 is thereby pulled toward the probe card 56, and the wafer W is electrically inspected while the test head 54, the pogo frame 58, the probe card 56, and the wafer chuck 50 are formed into a unified unit with reference to the head stage 52.

Inventors:
TAMURA HIROO (JP)
Application Number:
PCT/JP2016/060521
Publication Date:
October 06, 2016
Filing Date:
March 30, 2016
Export Citation:
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Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
H01L21/66
Foreign References:
JP2011089891A2011-05-06
JP2014075420A2014-04-24
JP2010034482A2010-02-12
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
Kenzo Matsuura (JP)
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