WATKINS CHARLES M (US)
| US4407658A | 1983-10-04 | |||
| FR2076479A5 | 1971-10-15 | |||
| US5157304A | 1992-10-20 | |||
| GB1482696A | 1977-08-10 | |||
| US4031597A | 1977-06-28 | |||
| GB1037609A | 1966-07-27 |
| 1. | A process for assembly of a FED wherein the FED comprises a faceplate and a cathode member, the process comprising: aligning the faceplate and the cathode member; disposing an adhesive between the faceplate and the cathode member; pressing the faceplate and the cathode member together; disposing a frit between the faceplate and a backplate assembly; and heating the frit seal to a temperature sufficient to cause the frit to seal. |
| 2. | A process as in claim 1 wherein said pressing occurs during said aligning. |
| 3. | A process as in claim 1 wherein said heating causes the adhesive to be removed. |
| 4. | A process as in claim 1 further comprising melting the adhesive from between the faceplate and the cathode member. |
| 5. | A process as in claim 4 further comprising isolating the adhesive from a cathode. |
| 6. | A process as in claim 5 wherein said isolating comprises placing the adhesive outside of the frit seal. |
| 7. | A process as in claim 6 wherein said isolating further comprises placing the adhesive in discrete locations around the frit seal. |
| 8. | A process as in claim 6 wherein said isolating further comprises placing the adhesive in a continuous strip around the frit seal. 97/23893 PC17US95/16653 6 . |
| 9. | A process as in claim 8 wherein said pressing causes a cold solder joint to form between the faceplate and the cathode member, wherein the cold solder joint effectuates a seal . |
| 10. | A process as in 8 wherein said pressing is performed at an elevated temperature. |
| 11. | A process as in claim 4 wherein said pressing causes a cold solder joint to form between the faceplate and the cathode member. |
| 12. | A process as in claim 11 wherein said adhesive consists of a material chosen from a group consisting of: indium, lead, tin, silver, cadmium, compounds and alloys. |
| 13. | A process as in claim 12 wherein said adhesive comprises indium. |
| 14. | A process as in claim 1 further comprising reducing the adhesive from between the faceplate and the cathode member. |
| 15. | A process as in claim 14 wherein said adhesive consists of an organic material chosen from a group consisting of: corn protein, polyvinyl alcohol, and acryloid. |
| 16. | A process as in claim 1 wherein said disposing an adhesive comprises placement of the adhesive on the faceplate before said pressing. |
| 17. | A process as in claim 1 wherein said disposing an adhesive comprises placement of the adhesive on the cathode member before said pressing. |
| 18. | A process as in claim 1 wherein said disposing an adhesive comprises pressing adhesive material. |
| 19. | A process as in claim 18 wherein said adhesive material comprises indium having a thickness of about 0.03 inches. |
| 20. | A process as in claim 1 wherein said disposing an adhesive comprises extrusion of an adhesive on one of the faceplate and the cathode member. |
| 21. | A process as in claim 20 wherein said extrusion comprises extrusion of a cold solder material . |
| 22. | A process as in claim 21 wherein said cold solder material comprises a material chosen from a group consisting of: indium, lead, tin, silver, cadmium, compounds and alloys . |
| 23. | A process as in claim 20 wherein said extrusion comprises extrusion of an organic binder. |
| 24. | A process as in claim 23 wherein said organic binder comprises an organic material chosen from a group consisting of: corn protein, polyvinyl alcohol, and acryloid. |
| 25. | A process as in claim 1 wherein said heating occurs in an evacuated space. |
| 26. | A process as in claim 1 wherein said pressing the faceplate and the cathode member together occurs before said disposing a frit seal between the faceplate and the backplate assembly. |
| 27. | A process as in claim 1 wherein said pressing the faceplate and the cathode member together occurs after said disposing a frit seal between the faceplate and the backplate assembly. |
| 28. | A process as in claim 1 wherein the cathode assembly and the backplate are integrally formed. 7/23893 PC17US96/16653 . |
| 29. | A FED comprising a faceplate and a cathode member, made according to a process comprising: aligning the faceplate and the cathode member; disposing an adhesive between the faceplate and the cathode member; pressing the faceplate and the cathode member together; disposing a frit seal between the faceplate and a backplate assembly; and heating the frit seal to a temperature sufficient to cause the frit to seal. |
| 30. | A FED as in claim 29 wherein said pressing occurs during said aligning. |
| 31. | A FED as in claim 29 wherein said heating causes the adhesive to be removed. |
| 32. | A FED as in claim 29 further comprising melting the adhesive from between the faceplate and the cathode member. |
| 33. | A FED as in claim 32 further comprising isolating the adhesive from a cathode. |
| 34. | A FED as in claim 33 wherein said isolating comprises placing the adhesive outside of the frit seal. |
| 35. | A FED as in claim 34 wherein said isolating further comprises placing the adhesive in discrete locations around the frit seal. |
| 36. | A FED as in claim 34 wherein said isolating further comprises placing the adhesive in a continuous strip around the frit seal. |
| 37. | A FED as in claim 36 wherein said pressing causes a cold solder joint to form between the faceplate and the cathode member, wherein the cold solder joint effectuates a seal . |
| 38. | A FED as in claim 32 wherein said pressing causes a cold solder joint to form between the faceplate and the cathode member. |
| 39. | A FED as in claim 29 wherein said adhesive consists of a material chosen from a group consisting of: indium, lead, tin, silver, cadmium, compounds and alloys. |
| 40. | A FED as in claim 39 wherein said adhesive comprises indium. |
| 41. | A FED as in claim 29 further comprising reducing the adhesive from between the faceplate and the cathode member. |
| 42. | A FED as in claim 41 wherein said adhesive consists of an organic material chosen from a group consisting of: corn protein, polyvinyl alcohol, and acryloid. |
| 43. | A FED as in claim 29 wherein said disposing an adhesive comprises placement of the adhesive on the faceplate before said pressing. |
| 44. | A FED as in claim 29 wherein said disposing an adhesive comprises placement of the adhesive on the cathode member before said pressing. |
| 45. | A FED as in claim 29 wherein said disposing an adhesive comprises pressing adhesive material . |
| 46. | A FED as in claim 45 wherein said adhesive material comprises indium having a thickness of about 0.03 inches. |
| 47. | A FED as in claim 29 wherein said disposing an adhesive comprises extrusion of an adhesive on one of the faceplate and the cathode member. |
| 48. | A FED as in claim 47 wherein said extrusion comprises extrusion of a cold solder material. |
| 49. | A FED as in claim 48 wherein said cold solder material comprises a material chosen from a group consisting cf: indium, lead, tin, silver, cadmium, compounds and alloys. |
| 50. | A FED as in claim 47 wherein said extrusion comprises extrusion of an organic binder. |
| 51. | A FED as in claim 50 wherein said organic binder comprises an organic material chosen from a group consisting of: corn protein, polyvinyl alcohol, and acryloid. |
| 52. | A FED as in claim 29 wherein said heating occurs in an evacuated space. |
| 53. | A FED as in claim 29 wherein said pressing the faceplate and the cathode member together occurs before said disposing a frit seal between the faceplate and the backplate assembly. |
| 54. | A FED as in claim 29 wherein said pressing the faceplate and the cathode member together occurs after said disposing a frit seal between the faceplate and the backplate assembly. |
| 55. | A FED as in claim 29 wherein the cathode assembly and the backplate are integrally formed. |
PROCESS FOR ALIGNING AND SEALING FIELD EMISSION DISPLAYS
Background of the Invention
This invention relates generally to flat panel emission displays and more particularly to methods of manufacturing field emission displays.
Field emission displays ("FEDs") are flat panel displays comprising faceplates on which phosphor pixels reside and cathode members have micro-tip cathodes which emit electrons to activate the phosphors . In some embodiments, the cathode member is attached to or integrally formed with a backplate, and in other embodiments, the cathode member is attached to the faceplate and surrounded by a separate backplate. In either case, the cathode member must be aligned with the faceplate so that the cathode tips are in opposed relation to the specific pixels which they are intended to activate. Also, because the display must operate in a vacuum (for example, 10"^ Torr) , a seal must be made between the backplate and the faceplate. Maintaining alignment while making the seal in high resolution displays and in large area displays is a very serious problem.
It is an object of the present invention to provide a method for making a FED whereby alignment of the cathode member and sealing of the backplate are accomplished in a manner which achieves more accuracy and efficiency than before.
Summary of the Invention
The above object is addressed, according to one aspect of the invention, by a FED comprising a faceplate and a cathode member, made according to a process comprising: aligning the faceplate and the cathode member; disposing an adhesive between the faceplate and the cathode member; pressing the faceplate and the cathode member together; disposing a frit seal between the faceplate and a backplate
assembly; and heating the frit seal to a temperature sufficient to cause the frit to seal.
Brief Description of the Drawings
For a more complete understanding of the present invention and for further advantages thereof, reference is made to the following Detailed Description of Example Embodiments taken in conjunction with the accompanying drawings, in which:
Fig. 1 is a side view of an embodiment of the present invention.
Fig. 2 is a side view of an embodiment of the present invention.
Fig. 3 is a top view of an embodiment of the present invention.
It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
Detailed Description of Example Embodiments
Referring to Fig. 1, a FED is seen comprising a faceplate 10 and a cathode member 12. In the embodiment shown, the cathode member 12 is formed integrally with the backplate, as in, for example, U.S. Patent No. 5,391,259, incorporated herein by reference. According to alternative embodiments (not shown) , the cathode member is separate from and surrounded by the backplate.
According to one embodiment of the invention, either type of FED is made according to a process comprising: aligning the faceplate 10 and the cathode member 12; disposing an adhesive 16 between the faceplate 10 and the cathode member 12; pressing the faceplate 10 and the backplate together; disposing a frit seal 18 between the faceplate 10 and the backplate; and heating the frit seal 18 to a temperature sufficient to cause the frit to seal.
According to a more specific embodiment, said pressing occurs during said aligning.
According to another embodiment, said heating causes the adhesive 16 to be removed, and in one specific embodiment, the adhesive 16 is melted from between the faceplate 10 and the cathode member 12, at least to a level that allows frit 18 to contact both the cathode member assembly 12, 14a-14b and the faceplate 10. See Fig. 2.
It should be noted that in the illustrated embodiment, cathode member 12 is separated from faceplate 10 by spacers 14a and 14b, which are made of a glass similar to the glass forming the backplate. Like the backplate, faceplate 10 is made of glass according to some embodiments . Acceptable glasses for faceplate 10 and cathode member assembly 12, 14a-14b include: Corning 7059, 1737, and soda-lime-silica.
It should be noted that in alternative embodiments, the cathode member assembly comprises no spacers 14a and 14b, and comprises simply a backplate with a cathode assembly formed thereon, as seen in, for example, U.S. Patent No. 5,329,207, incorporated herein by reference.
Referring now to Fig. 3, which is a top view of an example embodiment of the present invention, the adhesive 16 is isolated from the cathode 30 which is surrounded by frit seal 18. Also, according to the illustrated embodiment, the adhesive 16 is placed in discrete locations around the frit seal 18, although according to an alternative embodiment, the adhesive 16 is placed in a continuous strip (not shown) around the frit seal 18.
According to still a further embodiment, said pressing causes a cold solder joint to form between the faceplate 10 and the cathode member assembly 12, 14a-14b, wherein the cold solder joint effectuates a seal due to the composition of adhesive 16. For example, acceptable adhesives which form a cold solder joint include indium, lead, tin, silver, cadmium, and compounds and allows thereof. Some such materials require heating in order to become wet to glass .
According to another embodiment, removal of the adhesive 16 from between the faceplate 10 and the cathode member assembly 12, 14a-14b (Figs. 1 and 2) comprises reduction. According to alternative embodiments, the removal of adhesive 16 is conducted in an oxygen-containing atmosphere, and the adhesive 16 comprises an organic material, and the removal comprises oxidation of the organic material. Examples of acceptable organic adhesives include: corn protein (for example Zein), polyvinyl alcohol, acryloid material (for example Rolm 7 Haas B66 and B72) .
In some embodiments, said disposing an adhesive 16 comprises placement of the adhesive 16 on the faceplate 10 before said pressing, while in other embodiments, said disposing an adhesive 16 comprises placement of the adhesive 16 on the cathode member assembly 12, 14a-14b before said pressing. The disposing of adhesive 16 comprises, in one example embodiment, pressing adhesive material (for example, indium, having a thickness of about 0.03 inches) onto either cathode member assembly 12, 14a-14b or faceplate 10. According to an alternative embodiment, said disposing an adhesive 16 comprises extrusion of an adhesive 16 on either the faceplate 10 or the cathode member assembly 12, 14a-14b.
It will be noted that in further alternative embodiments, said pressing the faceplate 10 and the cathode member assembly 12, 14a-14b together occurs before said disposing a frit seal 18 between the faceplate 10 and the cathode member assembly 12, 14a-14b or after said disposing a frit seal 18 between the faceplate 10 and the cathode member assembly 12, 14a-14b.