Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PROCESS LIQUID COMPOSITION FOR PHOTOLITHOGRAPHY AND PATTERN FORMING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/060672
Kind Code:
A1
Abstract:
The present invention relates to a process liquid composition for reducing lifting defects in a hydrophobic photoresist pattern, in which the contact angle with water on the surface of the photoresist is at least 75°, in a photoresist patterning process, and more specifically, to a process liquid composition for reducing lifting defects in a photoresist pattern and a pattern forming method using same, the process liquid composition comprising: 0.00001 to 0.1 wt% of a fluorine-based surfactant; 0.00001 to 1.0 wt% of a material selected from the group consisting of a triol derivative, a tetraol derivative, and mixtures thereof; and a residual amount of water, and having a surface tension of 45 mN/m or less and a contact angle of 65° or less.

Inventors:
LEE SU JIN (KR)
KIM GI HONG (KR)
LEE SEUNG HUN (KR)
LEE SEUNG HYUN (KR)
Application Number:
PCT/KR2020/008142
Publication Date:
April 01, 2021
Filing Date:
June 24, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
YOUNG CHANG CHEMICAL CO LTD (KR)
International Classes:
G03F7/42; C11D1/00; C11D3/20; C11D11/00; G03F7/16; G03F7/20; G03F7/26; G03F7/30; G03F7/40
Foreign References:
JP2011197103A2011-10-06
JP2003255564A2003-09-10
JP2016504482A2016-02-12
KR20080009970A2008-01-30
KR20090017129A2009-02-18
Other References:
See also references of EP 4036648A4
Attorney, Agent or Firm:
HAEDAM IP GROUP (KR)
Download PDF: