PROCESS FOR MANUFACTURING SOLDERING MOUNTED STRUCTURE AND APPARATUS THEREFOR

Title:

PROCESS FOR MANUFACTURING SOLDERING MOUNTED STRUCTURE AND APPARATUS THEREFOR

Document Type and Number:

WIPO Patent Application WO/2007/097134

Kind Code:

A1

Abstract:

In the manufacturing of camera module structure (100), while melting a solder at solder joining area (3) by blowing hot air from hot air nozzle (4), hot air in convection toward the side of camera module (2) is suctioned by suction nozzle (5) from the side of camera module (2) relative to the position of hot air nozzle (4) disposed. Accordingly, there can be manufactured soldering mounted structures having electronic parts susceptible to heat mounted on a wiring board without being damaged by heat.

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Inventors:

KINOSHITA KAZUO
NISHIDA KATSUITSU

Application Number:

PCT/JP2007/050331

Publication Date:

August 30, 2007

Filing Date:

January 12, 2007

Export Citation:

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Assignee:

SHARP KK (JP)
KINOSHITA KAZUO
NISHIDA KATSUITSU

International Classes:

H05K3/34; B23K1/00; B23K1/012; B23K3/04

Foreign References:

JPH09108828A	1997-04-28
JPH06151032A	1994-05-31
JP2002134681A	2002-05-10

Attorney, Agent or Firm:

HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome Kita, Kita-k, Osaka-shi Osaka 41, JP)

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