Title:
PROCESS FOR PRODUCING COMPONENTS WITH PRESSURE-SENSITIVE ADHESIVE, AND COMPONENTS WITH PRESSURE-SENSITIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2017/006957
Kind Code:
A1
Abstract:
Provided are a process for producing components equipped with a pressure-sensitive adhesive and components equipped with a pressure-sensitive adhesive which are produced by this process, the process comprising a printing step in which a pressure-sensitive adhesive 20 in the state of having no tackiness is applied by printing to at least some of the one surface of a substrate 1 on which components are to be formed, an ultraviolet irradiation step in which after the printing step, the substrate 1 is irradiated with ultraviolet light 2 to make the pressure-sensitive adhesive 20 have tackiness, a release paper application step in which release paper 3 is applied to the one surface of the substrate 1, and a shape pressing step in which the shape of each component is formed by punching. In the process, a pressure-sensitive adhesive is not applied separately to individual components but is adhered in advance to components which are to be punched out of the substrate. Hence, the pressure-sensitive adhesive can be adhered to a plurality of components after one positioning alignment, and the necessity of separately applying a double-faced pressure-sensitive adhesive tape to each component can be avoided, thereby heightening the productivity.
Inventors:
SOMA KENJI
Application Number:
PCT/JP2016/069985
Publication Date:
January 12, 2017
Filing Date:
July 06, 2016
Export Citation:
Assignee:
MELTEC CORP (JP)
International Classes:
C09J7/02; G01D5/347
Foreign References:
| JP2002309194A | 2002-10-23 | |||
| JP2011074133A | 2011-04-14 | |||
| JP2010085578A | 2010-04-15 | |||
| JPH0914903A | 1997-01-17 |
Attorney, Agent or Firm:
ABE, Shinichi et al. (JP)
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