Title:
PROCESS FOR PRODUCTION OF HEAT-RESISTANT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2010/140663
Kind Code:
A1
Abstract:
Disclosed is a process for producing a heat-resistant structure that has excellent heat resistance, fire resistance, chemical resistance, water resistance, safety, economic efficiency and the like and can be produced within a short time in a simple manner. Specifically disclosed are: a process for producing a heat-resistant structure, which is characterized by heating a mixed solution prepared by mixing an aqueous sodium silicate solution with an aqueous poly(aluminum chloride) solution and increased in viscosity as a result of the mixing, at a temperature of 300˚C or higher before the mixed solution substantially starts to decrease in viscosity, thereby enclosing isolated air bubbles in the mixed solution; and a process for producing a heat-resistant structure, which is characterized by using a mixed solution that is prepared by further agitating the viscosity-increased mixed solution to decrease the viscosity of the mixed solution.
Inventors:
SUGIYAMA OSAMU (JP)
Application Number:
PCT/JP2010/059465
Publication Date:
December 09, 2010
Filing Date:
June 03, 2010
Export Citation:
Assignee:
HI VAN CORP (JP)
SUGIYAMA OSAMU (JP)
SUGIYAMA OSAMU (JP)
International Classes:
C04B38/10; C04B22/12; C04B28/26; C04B38/00; C04B40/02
Foreign References:
| JPH10338876A | 1998-12-22 | |||
| JP2000328056A | 2000-11-28 | |||
| JP2007138365A | 2007-06-07 |
Attorney, Agent or Firm:
TAKAHASHI NORIAKI (JP)
Noriaki Takahashi (JP)
Noriaki Takahashi (JP)
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