PROCESS FOR PRODUCTION OF PHOSPHORUS-ATOM-CONTAINING PHENOL, NOVEL PHOSPHORUS-ATOM-CONTAINING PHENOL, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR SEALING MATERIAL

Title:

Document Type and Number:

WIPO Patent Application WO/2010/106698

Kind Code:

A1

Abstract:

Disclosed are: a process for producing a phosphorus-atom-containing phenol, which is significantly superior in the reactivity in the reaction between a phosphorus-atom-containing compound with an aromatic nucleus in a phenol; a novel phosphorus-atom-containing phenol which can be used as a curing agent for an epoxy resin to impart excellent heat resistance to a cured product of the epoxy resin when a polyhydric phenol or a phenolic resin is used as the above-mentioned phenol in the phosphorus-atom-containing phenol; a curable resin composition comprising the phosphorus-atom-containing phenol; a cured product of the curable resin composition; a printed circuit board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on the aromatic nucleus is reacted with an organic phosphorus compound (a2) having a P-H group or a P-OH group in the molecular structure, and subsequently the resulting reaction product is reacted with a phenol (a3).

Inventors:

HAYASHI KOJI (JP)
TAKAHASHI YOSHIYUKI (JP)
OGURA ICHIROU (JP)

Application Number:

PCT/JP2009/063858

Publication Date:

September 23, 2010

Filing Date:

August 05, 2009

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS (JP)
HAYASHI KOJI (JP)
TAKAHASHI YOSHIYUKI (JP)
OGURA ICHIROU (JP)

International Classes:

C07F9/6574; C08G8/04; C08G8/28; H01L23/29; H01L23/31; H05K1/03

Foreign References:

JP2001220427A	2001-08-14
JP2002037852A	2002-02-06
JPH11166035A	1999-06-22
JP3464783B2	2003-11-10
JP3476780B2	2003-12-10
JP3613724B2	2005-01-26

Other References: