PROCESS FOR PRODUCTION OF VOID-CONTAINING RESIN MOLDINGS AND VOID-CONTAINING RESIN MOLDINGS OBTAINED BY THE PROCESS

WIPO Patent Application WO/2010/024068

A1

A process for the production of void-containing resin moldings, by which void-containing resin moldings which have high -saturation appearance excellent in brightness and are excellent in heat insulating properties can be produced; and void -containing resin moldings obtained by the process. The process for the production of void-containing resin moldings comprises the step of stretching a polymer molding containing a single crystalline polymer at least uniaxially and is characterized in that in the stress-strain diagram obtained in stretching the polymer molding in the first direction, the stress at 30% elongation (L30) and the yield stress (A) satisfy a specific relationship or in that in the stress-strain diagram obtained in stretching the polymer molding in the first direction, the stress at 40% elongation (L40), the yield stress (A), and the stress (B) at an inflection point where the stress after the yield stress (A) changes first from descent to ascent satisfy a specific relationship.

GOTO YASUTOMO (JP)
SASAKI HIROKI (JP)
OGURA TOORU (JP)
ARIOKA DAISUKE (JP)

PCT/JP2009/063208

March 04, 2010

July 23, 2009

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FUJIFILM CORP (JP)
GOTO YASUTOMO (JP)
SASAKI HIROKI (JP)
OGURA TOORU (JP)
ARIOKA DAISUKE (JP)

C08J9/00

WO2008126464A1

2008-10-23

JPH1045930A

1998-02-17

HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)

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