KREBELJ DENIS (SI)
PETAČ PRIMOŽ (SI)
| JP2009143190A | 2009-07-02 | |||
| JPH06125423A | 1994-05-06 |
| Claims 1. A process of thermoplastic bonding of two or several elements, particularly at a vehicle, preferably at a motor vehicle, characterized in that it comprises the following steps: a) disposing onto a first component part (1) a second component part (2), wherein each binding projection (3; 3’) of the first component part (1) is placed into a corresponding binding cut-out (6; 6’) of the second component part (2), and wherein each guiding projection (4; 4’) of the first component part (1) is placed into a corresponding guiding cut-out (10; 10’) of the second component part (2); b) locating the second component part (2) by moving thereof in longitudinal and/or transversal direction and/or rotating with regard to the binding projection (3; 3’) into a required position with regard to the first component part (1); c) entering thermal energy into the region of the free end of the binding projection (3; 3’), when the second component part is located (2) in the required position with regard to the first component part(l), resulting in softening of the binding projection (3; 3’); d) entering compressive force immediately after the softening of the binding projection (3; 3’) into the softened region of the binding projection (3; 3’), when the second component part (2) is located in the required position with regard to the first component part (1), resulting in the softened region of the binding projection (3; 3’) to flow mainly in transversal direction of the binding projection (3; 3’) and, respectively, in the plane of the second component part (2); e) filling-up of the binding cut-out (6; 6’) with said softened region of the binding projection (3; 3’), when the second component part (2) is located in the reguired position with regard to the first component part (1). 2. A process of thermoplastic bonding of two or several elements according to claim 1, characterized in that the first component part (1) is provided beforehand with at least one binding projection (3; 3’) and at least one guiding projection (4; 4’), and is the second component part (2) provided beforehand with at least one binding cut-out (6; 6’) and at least one guiding cut-out (10; 10’). 3. A process of thermoplastic bonding of two or several elements according to claim 2, characterized in that said guiding cut-out (10; 10’) comprises an inner circumferential wall (7; 7’), which is formed at least partially in a manner of waves, saw and similar, wherein said wave-shaped and, respectively, said saw-shaped formation comprises at least one crest (8) and at least one trough (9). 4. A process of thermoplastic bonding of two or several elements according to any of the preceding claims, characterized in that said softened region also fills-up the crests (8) and the troughs (9) in the circumferential wall (7; 7’) of the binding cut-out (6; 6’). 5. A process of thermoplastic bonding of two or several elements according to any of the preceding claims, characterized in that the rest of the softened region of the binding projection (3; 3’) spreads in a manner of a bulge over the surface of the second component part (2) averted from the first component part (1), fixing additionally the connection the first component part (1) - the second component part (2) after cooling of said softened region. 6. A lamp of a vehicle produced by a process according to any of the claims 1 to 5, characterized in that it comprises a first component part (1) and a second component part (2) being thermoplastically bonded to each other, wherein a) the first component part (1) comprises at its inner and/or outer surface at least one binding projection (3; 3’) that can be thermoplastically formed, and at least one guiding projection (4; 4’), and b) the second component part (2) is formed with at least one binding cut-out (6; 6’) configured for cooperation with said at least one binding projection (3; 3’), and with at least one guiding cut-out (10; 10’) configured for cooperation with said at least one guiding projection (4; 4’). 7. A lamp of a vehicle according to claim 6, characterized in that said guiding cut-out (10; 10’) can be formed as an elongated cut-out and/or as an arched cut-out extending eithe rin parallel with an/or perpendicular to the binding projection (3; 3’). 8. A lamp of a vehicle according to claims 6 and 7, characterized in that each binding cut- out (6; 6’) comprises an inner circumferential wall (7; 7’), which is formed at least partially in a manner of waves, saw and similar, wherein said wave-shaped and, respectively, said saw-shaped formation comprises at least one crest (8) and at least one trough (9). 9. A lamp of a vehicle according to any claim 6 to 8, characterized in that the projections (3’; 4’) can be integral part of the first component part (1) or can be formed as separate parts connected to the first component part (1) such as by means of an adhesive means, threaded means and similar. 10. A lamp of a vehicle according to any claim 6 to 9, characterized in that the first component part (1) is a reflector of a vehicle and the second component part (2) is a printed circuit board having at least one light source. |
PROCESS
[0001] The present invention refers to a process of thermoplastic bonding of two or several elements, particularly at a vehicle, preferably at a motor vehicle. The invention refers also to a lamp produced by said process.
[0002] In a car industry, particularly in the filed of lamp production, preferably LED lamps, a printed circuit board (PCB) comprising a light source is to be attached to a thermoplastic reflector. Known said attachment is formed, for example, by means of a bolted connection, wherein the position of the PCB can be set in one of the coordinate axis. A rotation and a torque is difficult to control during the attachment of the PCB by means of said bolted connection, leading to an unwanted light dissipation. In addition, said bolted connection is extremely susceptible to process parameters and the condition of the input components.
[0003] Also is known a process where the PCB comprising a light source is hot riveted to a vehicle reflector, particularly to a motor vehicle. With said process, at least one round through hole is made in PCB which corresponds in size and form to each stem formed on the reflector. The PCB is fixed on the reflector by means of a thermoplastic deformation of the stem. Each thermoplastic deformed stem locks all three components of translational degrees of freedom, whereby any setting is disabled before bonding.
[0004] It is the object of the present invention to create a process of bonding two or several elements, particularly at a vehicle, preferably at a motor vehicle, which remedies drawbacks of the knowns similar solution.
[0005] According to the present invention, the object as set above is solved by features set forth in the characterising part of claim 1. Detail of the invention is disclosed in respective subclaims.
[0006] The invention is further described in detail by way of non-limiting embodiment, and with a reference to the accompanying drawings, where Fig. 1 shows a simplified three-dimensional exploded view of a lamp according to the invention,
Fig. 2 shows a top view of the lamp of Fig. 1,
Fig. 3 shows a magnified detail of a thermoplastic bond according to the invention,
Fig. 4 shows another embodiment of the lamp of Fig. 1.
[0007] Description of the invention is based on a simplified embodiment of a motor vehicle lamp. The reference numeral 1 in drawings refers to a first component part of a thermoplastic bond, whereas the reference numeral 2 refers to a second component part of the thermoplastic bond. Generally, said first component part 1 can be selected as an element of plastic material, in the present embodiment, however, it is selected as a reflector or a part of the reflector of a motor vehicle lamp. Generally, said second component part 2 can be selected as an element of plastic material which is to be connected by means of a thermoplastic bonding with the first component part 1, said second component part 2 being selected in the present embodiment as a printed circuit board (PCB) having at least one semi-conductive light source.
[0008] Said first component part and, respectively, reflector 1 comprises at the inner and/or outer surface thereof at least one binding projection 3; 3’ that can be thermoplastically formed. Spaced from said binding projection 3 the reflector 1 is formed with at least one guiding projection 4; 4’. It is provided fro according to the present invention that the projections 3’; 4’ are arranged approximately perpendicular to the surface of the reflector 1. Moreover, said projections 3’; 4’ can be integral parts of the reflector 1 or can be formed as separate parts connected to the reflector 1 such as by means of an adhesive means, threaded means and similar.
[0009] With the first embodiment shown in Fig. 1, Fig. 2 and Fig. 3, said binding projection 3 is provided as an elongated projection formed at the top section thereof with a local depression 5. In the present embodiment, said depression 5 is formed as a groove extending approximately over the entire length of the free end of the binding projection 3, thus, facilitating access of the tool for thermoplastic forming and uniform deformation of the binding projection 3 being softened during thermoplastic forming.
[0010] According to the second embodiment shown in Fig. 4, said binding projection 3’ is provided as a cylindrical projection formed at the top section thereof with a local depression 5’. Said depression 5’ is formed in the second embodiment in a sense of a dome formed at the free end of the binding projection 3’, thus, facilitating access of the tool for thermoplastic forming and uniform deformation of the binding projection 3’ being softened during thermoplastic forming.
[0011] Said second component part and, respectively, the PCB 2 having at least one semi- conductive light source is formed with at least binding cut-out 6; 6’ configured for cooperation with said at least one binding projection 3; 3’ provided on the reflector 1. Said binding cut-out 6; 6’ is formed on the PCB 2 at the location, which lies, when the PCB 2 is placed on the reflector 1, directly above each corresponding binding projection 3; 3’. It is provided for, according to the preferred embodiment of the invention, that said binding cut-out 6; 6’ is approximately congruent with the binding projection 3; 3’. Each binding cut-out 6; 6’ comprises an inner circumferential wall 7; 7’, which is formed at least partially in a manner of waves, saw and similar, wherein said wave-shaped and, respectively, said saw-shaped formation comprises at least one crest 8 and at least one trough 9.
[0012] Said binding cut-out is formed according to the first embodiment as an elongated binding cut-out 6 the form and dimensions thereof are configured for receiving the elongated binding projection 3 of the reflector 1. Said binding cut-out is formed according to the second embodiment as a circular binding cut-out the form and dimensions thereof are configured for receiving the cylindrical binding projection 3’ of the reflector 1.
[0013] Furthermore, said second component part and, respectively, the PCB 2 having at least one semi-conductive light source is formed with at least one guiding cut-out 10; 10’, which is configured for cooperation with said at least one guiding projection 4; 4’ provided on the reflector 1. Said guiding cut-out 10; 10’ can be formed as an elongated cut-out and/or as an arched cut-out extending either in parallel with the binding projection 3; 3’ and/or perpendicularly thereto.
[0014] According to the first embodiment, said each guiding cut-out 10 configured to receive the cylindrical guiding projection 4 is formed as an elongated cut-out extending in the same direction as the elongated binding projection 3. When disposing the second component part and, respectively, the PCB 2 having at least one semi-conductive light source on the reflector 1, each cylindrical guiding projection 4 is placed into the corresponding elongated guiding cut-out 10, wherein said elongation of the cut-out 10 enables setting the PCB 2, in the plane thereof, in the longitudinal direction of the binding projection 3 before mutual fixing of the reflector 1 and the PCB 2 takes place. It is of course obvious, that said elongated cut-out 10 extends also perpendicularly to the direction of the elongated binding projection 3, thus, enabling the PCB 2 to be set, in the plane thereof, in transversal direction of the binding projection before mutual fixing of the reflector 1 and the PCB 2 takes place. According to the present invention an arbitrary combination of the cut-outs 10 extension is possible, thus, enabling the PCB 2 to be set in different directions with regard to the binding projection 3 before mutual fixing of the reflector 1 and the PCB 2 takes place.
[0015] According to the second embodiment, said guiding cut-out 10’ configured to receive the cylindrical guiding projection 4’ is formed as an arch-shaped cut-out. When disposing the second component part and, respectively, the PCB 2 having at least one semi-conductive light source on the reflector 1 each cylindrical binding projection 3’ is placed into the corresponding arch-shaped cut-out 10’, thus, rotational setting of the PCB 2, in the plane thereof, is enabled with respect to the reflector 1 about the centre line of the cylindrical binding projection 3’ before mutual fixing of the reflector 1 and the PCB 2 takes place.
[0016] Thermoplastic bonding of the first component part and, respectively, the reflector 1 and the second component part and, respectively, the PCB 2 is carried out in the following manner. The PCB 2, formed beforehand with at least one binding cut-out 6, 6’ and at least one guiding cut-out 10; 10’, is placed onto the reflector 1, formed beforehand with at least one binding projection 3;3’ and at least one guiding projection 4; 4’. Each binding projection 3; 3’ is placed into the corresponding binding cut-out 6; 6’, and each guiding projection 4; 4’ is placed into the corresponding guiding cut-out 10; 10’. Afterwards, the PCB 2 is set by moving in longitudinal and/or transversal direction and/or by rotating with respect to the binding projection 3; 3’ into a required position with respect to the reflector 1, said moving and, respectively, rotating being enabled by means of the elongated and, respectively, the arched shape of the guiding cut-outs 10; 10’.
[0017] When the PCB 2 is located in the wanted position with regard to the reflector 1, thermal energy is applied by means of an appropriate tool into the region of the free end of the binding projection 3; 3’ resulting in softening the binding projection 3; 3’. Immediately afterwards, compressive force is applied into the softened region of the binding projection 3; 3’ causing the softened region of the binding projection 3; 3’ to flow mainly in transversal direction of the binding projection and, respectively, in the plane of the PCB 2. Said softened region of the binding projection 3; 3’ fills up the binding cut-out 6; 6’ (shown in dashed line in Fig. 2 and Fig. 3), thus, filling also said crests 8 and troughs 9 in the circumferential wall 7; 7’ of the binding cut-out 6; 6’. The remaining part of the softened region of the binding projection 3; 3’ spreads in a manner of a bulge (shown in dashed line in Fig. 3) over the surface of the PCB 2 averted from the reflector 1, fixing additionally the connection reflector 1 - PCB 2 after cooling of said softened region.
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