Title:
PROCESSING CONDITION SETTING DEVICE, PROCESSING CONDITION SETTING METHOD, AND WAFER MANUFACTURING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/176576
Kind Code:
A1
Abstract:
A processing condition setting device 20 is provided with a control unit 22 for selecting a parameter set to be applied to a wafer processing device 1 from among a plurality of parameter sets. On the basis of a pre-processing characteristic of a wafer to be processed and processing data, the control unit 22 estimates, for each parameter set, a post-processing characteristic assuming that the parameter set has been applied and the wafer to be processed has been processed. The control unit 22 calculates at least two types of index for each post-processing characteristic, and acquires a constraining condition relating to the indexes. The control unit 22 selects the parameter set to be applied to the wafer processing device 1 when the wafer to be processed is processed from among matching parameter sets for which the indexes satisfy the constraining condition, among the parameter sets.
Inventors:
MIYAZAKI YUJI (JP)
Application Number:
PCT/JP2022/003436
Publication Date:
August 25, 2022
Filing Date:
January 28, 2022
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/005; B23Q15/00; H01L21/304
Foreign References:
| JP2009267159A | 2009-11-12 | |||
| JP2003085526A | 2003-03-20 | |||
| JP2019165123A | 2019-09-26 | |||
| JP2007220842A | 2007-08-30 | |||
| JP2005317864A | 2005-11-10 | |||
| JP2009065213A | 2009-03-26 | |||
| JP2005520317A | 2005-07-07 | |||
| JP2012228745A | 2012-11-22 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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