Title:
PROCESSING DEVICE AND METHOD FOR SETTING PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/061721
Kind Code:
A1
Abstract:
[Problem] To provide a processing device for uniformly grinding wafers held by a plurality of chucks, and a method for setting the processing device. [Solution] A processing device 1 includes a coarse grinding means 5 and a fine grinding means 6 that are provided in a column 4 straddling over a holding means 2. The holding means 2 includes: an index table 21; chucks 22 concentrically disposed about a rotation shaft 2a; a first movable support unit 24 disposed on the outer peripheral side of the chuck 22 in the radial direction of the index table; and a first fixed support unit 25 disposed on the inner peripheral side of the chuck 22 in the radial direction of the index table. The first movable support unit 24 is interposed between the index table 21 and the chuck 22, and can be freely expanded and contracted in a vertical direction.
Inventors:
SHIMODA MAKOTO (JP)
KANAZAWA MASAKI (JP)
KANAZAWA MASAKI (JP)
Application Number:
PCT/JP2017/032611
Publication Date:
April 05, 2018
Filing Date:
September 11, 2017
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
H01L21/304; B24B7/04
Foreign References:
| JP2002001653A | 2002-01-08 | |||
| JP2004082291A | 2004-03-18 | |||
| JP2016132071A | 2016-07-25 | |||
| JP2010172999A | 2010-08-12 | |||
| JP2008044079A | 2008-02-28 | |||
| JP2014069261A | 2014-04-21 | |||
| JP2016155204A | 2016-09-01 |
Attorney, Agent or Firm:
SHIMIZU Takamistu (JP)
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