PROCESSING LIQUID, METHOD FOR PROCESSING SUBSTRATE

WIPO Patent Application WO/2022/044893

A1

A problem addressed by the present invention is to provide a processing liquid for a semiconductor device, the processing liquid having excellent solubility in post-processing liquids together with excellent corrosion prevention for metal-containing layers and removability of objects to be removed. Another problem addressed by the present invention is to provide a method for processing a substrate using the processing liquid.　The processing liquid of the present invention is a processing liquid for a semiconductor device that includes water, a remover, and a copolymer. The copolymer has a first repeating unit having at least one group selected from the group consisting of primary amino groups, secondary amino groups, tertiary amino groups, and quaternary ammonium cations and a second repeating unit different from the first repeating unit.

TAKAHASHI TOMONORI (JP)
SUGISHIMA YASUO (JP)
MIZUTANI ATSUSHI (JP)

PCT/JP2021/030094

March 03, 2022

August 18, 2021

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FUJIFILM CORP (JP)

C11D17/08; C11D1/04; C11D1/06; C11D1/12; C11D1/29; C11D1/34; C11D3/04; C11D3/06; C11D3/20; C11D3/26; C11D3/28; C11D3/30; C11D3/34; C11D3/36; C11D3/37; C11D3/39; C11D3/43; C11D7/06; C11D7/08; C11D7/10; C11D7/16; C11D7/18; C11D7/22; C11D7/26; C11D7/28; C11D7/32; C11D7/34; C11D7/36; C11D7/38; C11D7/50; C23F1/14; H01L21/027; H01L21/304; H01L21/306

WO2018163781A1	2018-09-13
WO2018021038A1	2018-02-01
WO2019138814A1	2019-07-18

JP2019156990A	2019-09-19
JP2008020746A	2008-01-31
JP2019039027A	2019-03-14
JP2017150069A	2017-08-31
JP2014142635A	2014-08-07

ITOH Hideaki et al. (JP)

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