Title:
PROCESSING METHOD AND PROCESSING DEVICE FOR ELECTRONIC/ELECTRICAL DEVICE COMPONENT SCRAP
Document Type and Number:
WIPO Patent Application WO/2020/218376
Kind Code:
A1
Abstract:
Provided is a processing method for electronic/electrical device component scrap in which, in a sorting and processing step for smelting processing raw material for sorting, from the electronic/electrical device component scrap, a processing raw material that includes a valuable metal for processing in a smelting step, it is possible to reduce, in advance, component scrap that causes problems with the sorting and processing step. Provided is the processing method for electronic/electrical device component scrap, including a smelting raw material sorting and processing step for sorting the processing raw material that includes a valuable metal that can be processed in a smelting step from the electronic/electrical device component scrap, wherein the processing method for electronic/electrical device component scrap includes using a parallel link robot to remove lump copper wire scrap included in the electronic/electrical device component scrap.
Inventors:
AOKI KATSUSHI (JP)
Application Number:
PCT/JP2020/017390
Publication Date:
October 29, 2020
Filing Date:
April 22, 2020
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B07C5/342; B07C5/36; B09B5/00; B25J11/00; C22B1/00; G06T7/00; G06T7/90
Foreign References:
| JP2012210598A | 2012-11-01 | |||
| JP2017170388A | 2017-09-28 | |||
| JP2012115785A | 2012-06-21 | |||
| JP5969685B1 | 2016-08-17 | |||
| JP2019034399A | 2019-03-07 | |||
| JP2003534930A | 2003-11-25 | |||
| JP2013000685A | 2013-01-07 | |||
| JP2013255901A | 2013-12-26 | |||
| JP2002105548A | 2002-04-10 | |||
| JPH0978151A | 1997-03-25 | |||
| JP2015123418A | 2015-07-06 |
Other References:
See also references of EP 3960312A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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