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Patent Searching and Data


Title:
PROCESSING METHOD FOR MICROLENS ARRAY MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2022/181674
Kind Code:
A1
Abstract:
The present invention provides a processing method for a microlens array molding die, the microlens array comprising a plurality of microlenses of approximately the same shape, each of which comprises an optical axis in the same direction. When processing one surface, of the molding die, which corresponds to one microlens surface, in an (x, y, z) coordinate system comprising an x-axis, a y-axis, and a z-axis that are orthogonal to one another, wherein the z-axis is the direction of a central axis corresponding to the optical axis of the microlens one surface, processing is performed with (x, y, z) coordinates, which are processing points of a rotating implement, being changed, while keeping constant the value of an angle θ formed between the rotational axis of the implement and a straight line in the direction of the z-axis passing through a point on the rotational axis of the implement, and the value of an angle Φ around the straight line on a plane that includes the rotational axis of the implement and the straight line, and when processing a plurality of surfaces of the molding die, which correspond to a plurality of microlens surfaces, at least one value, between the angle θ and the angle Φ, is distributed within a prescribed range on each surface.

Inventors:
NISHIO YUKINOBU (JP)
HAMATANI TOSHIKI (JP)
KUWAGAITO TOMOHITO (JP)
Application Number:
PCT/JP2022/007560
Publication Date:
September 01, 2022
Filing Date:
February 24, 2022
Export Citation:
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Assignee:
NALUX CO LTD (JP)
International Classes:
G02B3/00; B29C33/38; B29C33/42
Foreign References:
JP2006289566A2006-10-26
JP2012101291A2012-05-31
US20110027032A12011-02-03
Attorney, Agent or Firm:
FUSHIMI, Naoya (JP)
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