Title:
PROCESSOR CONTAINING THREE-DIMENSIONAL MEMORY ARRAY
Document Type and Number:
WIPO Patent Application WO/2017/137015
Kind Code:
A3
Abstract:
A three-dimensional processor (100) containing a three-dimensional memory (3D-M) array (170), said processor containing a plurality of computation units (110-i) formed on a semiconductor substrate, each computation unit containing an arithmetic logic circuit (ALC) (180) and a 3D-M-based lookup table (3DM-LUT), the ALC (180) being formed in the semiconductor substrate (0K) and performing an arithmetic operation on 3DM-LUT data, the 3DM-LUT storing data related to a mathematical function or a mathematical model and containing at least one 3D-M array (170), the 3D-M array (170) being stacked above the ALC (180). The programmable computation units perform field customisation with regard to computation.
Inventors:
ZHANG GUOBIAO (CN)
SHEN CHEN (CN)
SHEN CHEN (CN)
Application Number:
PCT/CN2017/080462
Publication Date:
October 05, 2017
Filing Date:
April 13, 2017
Export Citation:
Assignee:
CHENGDU HAICUN IP TECHNOLOGY LLC (CN)
International Classes:
G06F7/57; G06T1/20; H01L27/10
Foreign References:
| CN103633091A | 2014-03-12 | |||
| CN104205234A | 2014-12-10 | |||
| CN102217066A | 2011-10-12 | |||
| CN102270504A | 2011-12-07 | |||
| US20140183691A1 | 2014-07-03 | |||
| US20140085959A1 | 2014-03-27 |
Attorney, Agent or Firm:
CHENGDU CENTRAL ASIA PATENT AGENCY CO., LTD (CN)
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