Title:
PRODUCTION METHOD FOR COPPER PARTICLES, BONDING PASTE, SEMICONDUCTOR DEVICE, AND ELECTRICAL AND ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2020/044983
Kind Code:
A1
Abstract:
Provided is a production method for copper particles having: a step for mixing a copper compound, an amine compound, and a reducing compound in an organic solvent and obtaining a copper particle dispersion; and a cleaning step for subjecting the copper particle dispersion obtained in the aforementioned step to solvent cleaning and separating copper particles from the copper particle dispersion by a solid-liquid separation process, wherein the cleaning step is carried out in a closed system.
Inventors:
KIKUCHI TOMONAO (JP)
NITANAI YUYA (JP)
NITANAI YUYA (JP)
Application Number:
PCT/JP2019/030832
Publication Date:
March 05, 2020
Filing Date:
August 06, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/52; B22F1/00; B22F7/08; B22F9/24; H01B1/02; H01B1/22; H01B13/00
Domestic Patent References:
| WO2007043664A1 | 2007-04-19 |
Foreign References:
| JP2004232012A | 2004-08-19 | |||
| JP2010059453A | 2010-03-18 | |||
| JP2015059243A | 2015-03-30 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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