PRODUCTION METHOD FOR ETCHING LIQUID COMPOSITION

Title:

PRODUCTION METHOD FOR ETCHING LIQUID COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2024/053659

Kind Code:

A1

Abstract:

One aspect of the present invention provides a production method for an etching liquid composition that makes it possible to suppress dripping when a container is filled.　One aspect of the present disclosure relates to a production method for an etching liquid composition that is for etching a metal film formed on a substrate. The production method includes a step in which a filling nozzle that has a filling port that discharges the etching liquid composition is used to fill a container with the etching liquid composition. The receding contact angle of the etching liquid relative to the material of the filling port of the filling nozzle is at least 60°, and the ratio (advancing contact angle/receding contact angle) of the advancing contact angle and the receding contact angle is no more than 1.4.

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Inventors:

KIMURA YOSUKE
SATO KANJI

Application Number:

PCT/JP2023/032473

Publication Date:

March 14, 2024

Filing Date:

September 06, 2023

Export Citation:

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Assignee:

KAO CORP (JP)

International Classes:

C23F1/26; C23F1/18; C23F1/20; C23F1/28; C23F1/30; H01L21/308

Domestic Patent References:

WO2019026478A1

2019-02-07

Foreign References:

JP2013237873A	2013-11-28
JP2002075186A	2002-03-15
KR20160114887A	2016-10-06

Attorney, Agent or Firm:

IKEUCHI & PARTNERS (JP)

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