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Patent Searching and Data


Title:
PRODUCTION METHOD FOR LAMINATE HAVING PATTERNED METAL FILMS, AND PLATING LAYER-FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/133032
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a production method for a laminate having patterned metal films, capable of readily plasma etching a plating layer and of obtaining a laminate having excellent insulating properties between the patterned metal films. This production method for the laminate having patterned metal films comprises: a plating layer-forming step in which a plating layer is formed on top of a substrate, using a plating layer-forming composition including a binary copolymer comprising a prescribed unit; a catalyst application step in which a plating catalyst or a precursor thereof is applied to the plating layer; a plating step in which plating is performed and a metal film is formed on top of the plating layer; a pattern-forming step in which an etching fluid is used and a patterned metal film is formed; an acidic solution contacting step in which the substrate having the patterned metal film and an acidic solution are brought in contact; and a plating layer-removal step in which the plating layer in an area in which no patterned metal film is formed is removed by plasma etching.

Inventors:
KANO TAKEYOSHI (JP)
UEKI SHIKI (JP)
HAMA TAKESHI (JP)
Application Number:
PCT/JP2012/057148
Publication Date:
October 04, 2012
Filing Date:
March 21, 2012
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
KANO TAKEYOSHI (JP)
UEKI SHIKI (JP)
HAMA TAKESHI (JP)
International Classes:
H05K3/06; C08F220/06; C08F220/38; C08F220/58; C08F230/02; C08L33/02; C08L43/00; C23C18/16; H05K3/26; H05K3/38
Foreign References:
JP2007287994A2007-11-01
JP2008135685A2008-06-12
JP2001196728A2001-07-19
JP2004311912A2004-11-04
JP2008277717A2008-11-13
JP2010077322A2010-04-08
JP2000204480A2000-07-25
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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Claims: