Title:
PRODUCTION METHOD FOR PHOTOSENSITIVE DRUM-USE SUBSTRATE AND PHOTOSENSITIVE DRUM-USE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2002/084407
Kind Code:
A1
Abstract:
A photosensitive drum-use substrate used in electrophotographic process is produced by ultrasonic-welding a resin-made flange or gear flange to an end of a cylindrical substrate formed from a conductive resin composition in which a conductive material and a filler is mixed/dispersed into a substrate resin. Ultrasonic welding can efficiently produce a photosensitive drum-use substrate, and positively provide a high-rotation-accuracy photosensitive drum-use substrate. Such a photosensitive drum-use substrate, when used, can form a high-quality image.
Inventors:
IIZUKA MUNENORI (JP)
SUZUKI TAKAHIRO (JP)
MACHIDA KUNIO (JP)
SUZUKI TAKAHIRO (JP)
MACHIDA KUNIO (JP)
Application Number:
PCT/JP2002/003661
Publication Date:
October 24, 2002
Filing Date:
April 12, 2002
Export Citation:
Assignee:
BRIDGESTONE CORP (JP)
IIZUKA MUNENORI (JP)
SUZUKI TAKAHIRO (JP)
MACHIDA KUNIO (JP)
IIZUKA MUNENORI (JP)
SUZUKI TAKAHIRO (JP)
MACHIDA KUNIO (JP)
International Classes:
B29C65/08; G03G5/10; (IPC1-7): G03G5/10; G03G21/00
Foreign References:
| JP2000280348A | 2000-10-10 | |||
| JP2001282045A | 2001-10-12 | |||
| JP2001282044A | 2001-10-12 | |||
| US5991574A | 1999-11-23 | |||
| JP2000075529A | 2000-03-14 |
Other References:
See also references of EP 1385060A4
Attorney, Agent or Firm:
Ohtani, Tamotsu (6F. 25-2, Toranomon 3-chom, Minato-ku Tokyo, JP)
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