PRODUCTION METHOD FOR PRINTED CIRCUIT BOARD EQUIPPED WITH ELECTRIC-COMPONENT CONNECTION UNIT, AND ELECTRIC CIRCUIT DEVICE HAVING PRINTED CIRCUIT BOARD OBTAINED BY SAID PRODUCTION METHOD EMBEDDED THEREIN

WIPO Patent Application WO/2015/098481

A1

The present invention relates to: a novel production method for a printed circuit board equipped with an electric-component connection unit, by which the electric-component connection unit can be automatically mounted to the printed circuit board by reflow soldering and without the need for conveying tools, even when the electric-component connection unit is arranged along substantially the entire length of a width direction edge of the printed circuit board; and an electric circuit device having the printed circuit board obtained by said novel production method embedded therein. Included are: a printed circuit board preparation step in which a printed circuit board (12) to which a pair of disposable substrates (80)(80), which are supported by a conveying rail (90), are removably linked is prepared; a reflow step in which, in a state such that the electric-component connection unit (18) is loaded on a mounting unit (16), the pair of disposable substrates (80) (80) are supported by the conveying rail (90) and the printed circuit board (12) is conveyed into a reflow furnace; and a removal step in which, subsequent to the reflow step, a disposable substrate (80) is removed.

SAWAI SHINJI (JP)
UMEMOTO YOSHIO (JP)

PCT/JP2014/082444

July 02, 2015

December 08, 2014

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SUMITOMO WIRING SYSTEMS (JP)

H05K3/34; H02G3/16; H05K1/02

WO2011004650A1

2011-01-13

JP2004228470A	2004-08-12
JP2009224696A	2009-10-01
JP2012115052A	2012-06-14
JPH0797699B2	1995-10-18
JP2003174240A	2003-06-20

KASAI, Yoshitaka et al. (JP)
Yoshitaka Kasai (JP)

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