PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGES

WIPO Patent Application WO/2021/192341

A1

According to the present disclosure, a production method for semiconductor packages includes (A) a step for forming a temporary fixing material layer on a first surface (a circuit exposure surface) of a panel member that includes a plurality of semiconductor packages, (B) a step for pasting an adhesive film onto a second surface of the panel member, (C) a step for dicing the panel member and the temporary fixing material layer that are on the adhesive film into a plurality of semiconductor packages that have a temporary fixing material piece, (D) a step for arranging the plurality of semiconductor packages that have a temporary fixing material piece on a support carrier such that the interval between adjacent semiconductor packages that have a temporary fixing material piece is at least 0.1 mm, (E) a step for removing the adhesive film from the support carrier and the plurality of semiconductor packages that have a temporary fixing material piece, and (F) a step for forming a functional layer on the surface of the plurality of semiconductor packages that have a temporary fixing material piece.

FUKUZUMI SHIZU (JP)
SUZUKI NAOYA (JP)

PCT/JP2020/028926

September 30, 2021

July 28, 2020

Click for automatic bibliography generation  

SHOWA DENKO MATERIALS CO LTD (JP)

H01L23/00; H01L21/56; H05K9/00

WO2018216621A1

2018-11-29

JP2019009371A	2019-01-17
JP2000164682A	2000-06-16
JP2015195398A	2015-11-05
US8084300B1	2011-12-27
JP2017208529A	2017-11-24

HASEGAWA Yoshiki et al. (JP)

View/Download PDF      PDF Help

Previous Patent: BUSBAR UNIT

Next Patent: AUGMENTED REALITY CONTENT GENERATION DEVICE AND AUGMENTED REALITY CONTENT DISPLAY DEVICE