Title:
PRODUCTION METHOD FOR SHEET AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/045943
Kind Code:
A1
Abstract:
A sheet production method that comprises: a sheet manufacturing step for manufacturing a sheet that comprises a particle-containing resin sheet that contains particles and a resin component, a first release sheet that is provided to one thickness-direction surface of the particle-containing resin sheet, and a second release sheet that is provided to the other thickness-direction surface of the particle-containing resin sheet; and a cutting step for cutting the sheet from the other thickness-direction side to the one thickness-direction side. A first adhesive force of the first release sheet with regard to the particle-containing resin sheet is less than a second adhesive force of the second release sheet with regard to the particle-containing resin sheet, or the first adhesive force and the second adhesive force are the same and are 0.04 N/20 mm or more, and the thickness of the first release sheet is thinner than the thickness of the second release sheet.
Inventors:
KUROYANAGI ISAO (JP)
ODA TAKASHI (JP)
ODA TAKASHI (JP)
Application Number:
PCT/JP2014/074380
Publication Date:
April 02, 2015
Filing Date:
September 16, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B26D3/00; B32B37/00; H01L21/56
Foreign References:
| JP2010524236A | 2010-07-15 | |||
| JPH07232490A | 1995-09-05 | |||
| JPH01202433A | 1989-08-15 | |||
| JPS57147568A | 1982-09-11 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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