PROFILING CONTROL METHOD

Title:

PROFILING CONTROL METHOD

Document Type and Number:

WIPO Patent Application WO/1985/001234

Kind Code:

A1

Abstract:

A profiling control method which makes it possible to reduce machining time and to reduce wear on a cutter (CT) where profiling is effected by a stylus (ST) following a recess in a model (MDL). In this method, the clamp level is successively changed. A contour profiling along the entire circumference of the inner wall of the recess in the model (MDL) and X-Y plane profiling for cutting any machined portion remaining uncut after the contour profiling above the clamp level are executed at each of the successive clamp levels.

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WO/1984/002487	METHOD OF CONTROLLING PROFILING

Inventors:

YAMAZAKI ETUO (JP)

Application Number:

PCT/JP1984/000443

Publication Date:

March 28, 1985

Filing Date:

September 13, 1984

Export Citation:

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Assignee:

FANUC LTD (JP)

International Classes:

B23Q35/48; B23Q35/121; G05D3/00; (IPC1-7): B23Q35/00

Foreign References:

JPS5871047A	1983-04-27
JPS5511741A	1980-01-26

Other References: