Title:
PROTECTIVE FILM-EQUIPPED LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM
Document Type and Number:
WIPO Patent Application WO/2023/074536
Kind Code:
A1
Abstract:
Provided are: a laminate in which it is possible to peel the protective film from a protective film-equipped laminate of a heat-resistant polymer film and an inorganic substrate without peeling off the heat-resistant polymer film or inorganic substrate; and a method for manufacturing the laminate. The laminate comprises a protective film, a heat-resistant polymer film, and an inorganic substrate, in that order, and is characterized in that the peel strength F1 according to a 90° peeling test of the inorganic substrate and the heat-resistant polymer film, the angle θ formed by the protective film and the heat-resistant polymer film when the protective film is peeled from the heat-resistant polymer film, the tensile force T applied to the protective film, and the elastic modulus E of the protective film satisfy (1) Tsinθ < F1 and (2) E > 2GPa.
Inventors:
TOKUDA KAYA (JP)
OKUYAMA TETSUO (JP)
MAEDA SATOSHI (JP)
OKUYAMA TETSUO (JP)
MAEDA SATOSHI (JP)
Application Number:
PCT/JP2022/039172
Publication Date:
May 04, 2023
Filing Date:
October 20, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B7/022; C09J7/38
Domestic Patent References:
| WO2021199798A1 | 2021-10-07 | |||
| WO2022185606A1 | 2022-09-09 | |||
| WO2022202653A1 | 2022-09-29 |
Foreign References:
| JP2020199766A | 2020-12-17 | |||
| JP2020100026A | 2020-07-02 | |||
| KR20130111665A | 2013-10-11 | |||
| JP2021062571A | 2021-04-22 | |||
| US20210226177A1 | 2021-07-22 |
Download PDF: