Title:
PROTECTIVE FILM FORMATION AGENT, AND PRODUCTION METHOD FOR SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2022/153858
Kind Code:
A1
Abstract:
Provided are: a protective film formation agent that is used, in dicing of a semiconductor wafer, in order to form a protective film on the surface of the semiconductor wafer, and that is capable of forming a protective film which allows formation of processed grooves having excellent straightness by irradiation with laser and which has excellent fluorine-shielding ability; and a method for producing a semiconductor chip using the protective film formation agent. This protective film formation agent contains a water-soluble resin (A), a light-absorbing agent (B), and a solvent (S). The water-soluble resin (A) contains a water-soluble resin (A1). The water-soluble resin (A1) has an aromatic ring and a water-soluble group. The water-soluble resin (A) preferably has a benzene ring as an aromatic monocyclic ring.
Inventors:
KINOSHITA TETSURO (JP)
SHIBUTA YUSUKE (JP)
SHIBUTA YUSUKE (JP)
Application Number:
PCT/JP2021/048546
Publication Date:
July 21, 2022
Filing Date:
December 27, 2021
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
H01L21/301
Domestic Patent References:
| WO2020100403A1 | 2020-05-22 |
Foreign References:
| JP2020066665A | 2020-04-30 | |||
| JP2019212764A | 2019-12-12 | |||
| JP2018174310A | 2018-11-08 | |||
| JP2020066666A | 2020-04-30 | |||
| JP2014523112A | 2014-09-08 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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