Title:
PROTECTIVE FILM, RESIN SUBSTRATE, LAMINATE OF PROTECTIVE FILM AND RESIN SUBSTRATE, RESIN SHEET LAMINATE, AND PROTECTIVE FILM SET
Document Type and Number:
WIPO Patent Application WO/2022/210702
Kind Code:
A1
Abstract:
A protective film 10 according to the present invention is applied to a resin substrate 21 when heating and bending the resin substrate 21, and includes a base material layer and an adhesive layer located between the base material layer and the resin substrate and adhering to the resin substrate, the base material layer includes a laminate including a first layer located opposite the adhesive layer and a second layer located on the adhesive layer side, and the protective film 10 has a trouser elongation strain at break of 300% or less in directions inclined at 45° to both MD and TD of the protective film, the trouser elongation strain at break being measured in accordance with JIS K 7128-1 (1998).
Inventors:
OYA HIROSHI (JP)
MATSUI TOMOKI (JP)
IZUMI ATSUSHI (JP)
MATSUI TOMOKI (JP)
IZUMI ATSUSHI (JP)
Application Number:
PCT/JP2022/015418
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/00; B29C53/04; B32B7/025; B32B7/027; B32B7/06; B32B27/32; C09J7/29; C09J7/38; C09J123/00; G02B5/22; G02B5/30; G02C7/10
Domestic Patent References:
| WO2015129426A1 | 2015-09-03 |
Foreign References:
| JP2020175672A | 2020-10-29 | |||
| JP2008030349A | 2008-02-14 | |||
| JP2018183922A | 2018-11-22 | |||
| JP2020026103A | 2020-02-20 | |||
| JPH09176586A | 1997-07-08 | |||
| JP2012212120A | 2012-11-01 | |||
| JP2003145616A | 2003-05-20 | |||
| JP2017116882A | 2017-06-29 | |||
| JP2020026103A | 2020-02-20 |
Attorney, Agent or Firm:
MASUDA, Tatsuya et al. (JP)
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