Title:
PROTECTIVE FILM FOR SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2013/121701
Kind Code:
A1
Abstract:
The present invention provides a protective film for semiconductor wafers which is provided with a base film and a protective membrane formed on the upper side of the base film, wherein the protective film for a semiconductor wafer is characterized in that the protective membrane contains components (A)-(E) below. (A) 100 parts by mass of at least one type of resin selected from the group consisting of phenoxy resins, polyimide resins, and (meth)acrylic resins; (B) 5-200 parts by mass of an epoxy resin; (C) 100-400 parts by mass of a filler other than a fibrous inorganic filler; (D) a catalytic quantity of an epoxy resin curing catalyst; and (E) 25-5000 parts by mass of a fibrous inorganic filler. A semiconductor wafer protective film having excellent cutting properties, and a highly productive method for manufacturing semiconductor chips, are provided thereby.
Inventors:
ICHIROKU NOBUHIRO (JP)
Application Number:
PCT/JP2013/000347
Publication Date:
August 22, 2013
Filing Date:
January 24, 2013
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
H01L21/301; C09J7/20; C09J11/04; C09J133/00; C09J163/00; C09J171/10; C09J179/08
Foreign References:
| JP2004214288A | 2004-07-29 | |||
| JP2008247937A | 2008-10-16 | |||
| JP2011162603A | 2011-08-25 | |||
| JP2007512706A | 2007-05-17 | |||
| JP2010126617A | 2010-06-10 | |||
| JP2008248129A | 2008-10-16 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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Claims: