Title:
PROVISIONAL-FIXING SUBSTRATE, COMPOSITE SUBSTRATE, AND ELECTRONIC COMPONENT DEBONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/195932
Kind Code:
A1
Abstract:
The present invention improves debonding yield when an electronic component is provisionally fixed to a provisional-fixing substrate and then the provisional-fixing substrate is debonded by performing laser light irradiation from the provisional-fixing substrate side. A provisional-fixing substrate 2 is provided with a fixing surface 2a for bonding and provisionally fixing an electronic component, and a bottom surface 2b disposed on the opposite side to the fixing surface 2a. The provisional-fixing substrate 2 includes an outer periphery portion 9 and an inner periphery portion 10. The inner periphery portion 9 has a total light transmittance lower than a total light transmittance of the outer periphery portion 10 and is more than or equal to 60.0%.
Inventors:
NOMURA MASARU (JP)
MIYAZAWA SUGIO (JP)
MIYAZAWA SUGIO (JP)
Application Number:
PCT/JP2020/011046
Publication Date:
October 01, 2020
Filing Date:
March 13, 2020
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2015228483A | 2015-12-17 | |||
| JP2007251080A | 2007-09-27 | |||
| JP2013247280A | 2013-12-09 |
Attorney, Agent or Firm:
HOSODA Masutoshi et al. (JP)
Download PDF: