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Patent Searching and Data


Title:
PUNCHED PORTION RECEIVING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/249894
Kind Code:
A1
Abstract:
Provided is a punched portion receiving device capable of reliably removing a punched portion of a sheet material punched by an upper die, as punched scrap. A punched portion receiving device 30 for receiving a punched portion P of a sheet material S, which is punched by an upper die 3, so as to be able to reliably remove the punched portion P as punched scrap, the punched portion receiving device 30 comprising: a movable body 40 for receiving the punched portion P; a support body 50 for movably supporting the movable body 40; a guide means 70 for guiding the movable body 40; a movable body side engaging portion 32 and a support body side engaging portion 31 provided on the movable body 40 and the support body 50, respectively, so as to attract and engage by magnetic force. When the movable body 40 is pressed down by the upper die 3 through the punched portion P, the attractive engagement between the movable body side engaging portion 32 and the support body side engaging portion 31 is released, and the movable body 40 is guided by the guide means 70 and moves inward of the support body 50 as the movable body 40 advances downward.

Inventors:
OTSUKA JOJI (JP)
Application Number:
PCT/JP2022/020105
Publication Date:
December 01, 2022
Filing Date:
May 12, 2022
Export Citation:
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Assignee:
DAISO CO LTD (JP)
International Classes:
B26D7/18; B26F1/40; B26F1/44
Foreign References:
JP2012183641A2012-09-27
JPH03264295A1991-11-25
JPH11300696A1999-11-02
US20190111580A12019-04-18
Attorney, Agent or Firm:
OKINAKA Jin (JP)
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