Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PUNCHING DIE AND PUNCHING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/089689
Kind Code:
A1
Abstract:
The present invention enables simplification of the work for forming a punching die, enables stabilization and support of a blade member, enables increasing punching precision, and enables improving durability. The present invention has: a plurality of wooden molding boards (P1, P2) formed by performing a heat-pressing process on wood chips at a prescribed temperature and a prescribed pressure; a die substrate (32) formed by placing the molding boards (P1, P2) on top of each other and adhering the molding boards (P1, P2) together via an adhesive agent (35); and a blade member press-fitted into a groove formed by piercing the die substrate (32) by using laser processing. The density of near-surface regions, which are regions near both surfaces of the die substrate (32), and of central regions, which are adjoining regions on either side of the adhesive agent (35), is greater than the density of intermediate regions between the near-surface regions and the central regions.

Inventors:
JUNG IN BAE (JP)
LEE SI JOON (KR)
KIM JEONG SOO (KR)
WOO YOUNG DO (KR)
KWACK IN YOUNG (KR)
PARK DONG SOO (KR)
Application Number:
PCT/JP2021/042215
Publication Date:
May 25, 2023
Filing Date:
November 17, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SDS JAPAN CO LTD (JP)
DONGWHA ENTPR CO LTD (KR)
International Classes:
B26F1/44
Foreign References:
JPH0215298U1990-01-30
JP4224125B12009-02-12
JP3132970U2007-06-28
JP2014034091A2014-02-24
JPS6232800U1987-02-26
JP2002067189A2002-03-05
JP2001322102A2001-11-20
US20100159188A12010-06-24
Attorney, Agent or Firm:
KAWAI Makoto (JP)
Download PDF: