Title:
PUNCTURE SUPPRESSING AGENT FOR DEEP-FRIED FOOD, METHOD FOR SUPPRESSING PUNCTURE, AND DEEP-FRIED FOOD
Document Type and Number:
WIPO Patent Application WO/2020/031837
Kind Code:
A1
Abstract:
This puncture suppressing agent for deep-fried food contains a component A that satisfies conditions (1) to (4): (1) the starch content is 75 mass% or greater; (2) a low-molecule starch made from a starch containing amylose by 5 mass% or more is included at 3-45 mass%, and the peak molecular weight of the low-molecule starch is 3 × 103 to 5 × 104; (3) the degree of cold-water swelling at 25°C is 5-20; and (4) the amount that is over a sieve having a mesh opening of 0.075 mm and under a sieve having a mesh opening of 0.5 mm accounts for 30-100 mass%.
Inventors:
KUBOTA JUNPEI (JP)
YAMAKU KEIKO (JP)
HORIGANE TOMOKI (JP)
SAITO SANSHIRO (JP)
YAMAKU KEIKO (JP)
HORIGANE TOMOKI (JP)
SAITO SANSHIRO (JP)
Application Number:
PCT/JP2019/030202
Publication Date:
February 13, 2020
Filing Date:
August 01, 2019
Export Citation:
Assignee:
J OIL MILLS INC (JP)
International Classes:
A23L5/10; A23L29/219; A23L35/00
Domestic Patent References:
WO2014132534A1 | 2014-09-04 | |||
WO2017188089A1 | 2017-11-02 | |||
WO2017199924A1 | 2017-11-23 | |||
WO2013108910A1 | 2013-07-25 |
Foreign References:
JP2013198479A | 2013-10-03 | |||
JP2014121272A | 2014-07-03 | |||
JP2006006236A | 2006-01-12 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF:
Previous Patent: POLYMERIZABLE IONIC LIQUID, POLYMER, CURABLE COMPOSITION, ELECTROCHEMICAL ELEMENT MATERIAL, AND ANTI...
Next Patent: BAND PASS FILTER
Next Patent: BAND PASS FILTER