Title:
PURE COPPER MATERIAL, INSULATING SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/024898
Kind Code:
A1
Abstract:
A pure copper material according to the present invention has a Cu content within the range of 99.9 mass% to 99.999 mass%, while having an average crystal grain size of 10 μm or more in a rolled surface; and if a measurement area of 1 mm2 or more is measured by means of an EBSD method in steps with measurement intervals of 1 μm and the boundaries at which the misorientation between adjacent pixels is 5° or more are considered as crystal grain boundaries, while excluding the measurement points at which the CI value as obtained by an analysis using data analysis software OIM is 0.1 or less, the average of Local Orientation Spread (LOS) is 2.00° or less.
Inventors:
ODAIRA TAKUMI (JP)
ITO YUKI (JP)
KAWASAKI KENICHIRO (JP)
MAKI KAZUNARI (JP)
ITO YUKI (JP)
KAWASAKI KENICHIRO (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2023/027613
Publication Date:
February 01, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22C1/02; C22F1/00; C22F1/08; H01B1/02
Domestic Patent References:
| WO2021177469A1 | 2021-09-10 | |||
| WO2021107096A1 | 2021-06-03 | |||
| WO2021177470A1 | 2021-09-10 | |||
| WO2021177460A1 | 2021-09-10 | |||
| WO2020122112A1 | 2020-06-18 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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