Title:
PUTTY SHEET AND RECESSED PORTION SMOOTHING METHOD USING PUTTY SHEET
Document Type and Number:
WIPO Patent Application WO/2022/102175
Kind Code:
A1
Abstract:
[Problem] To provide a putty sheet and a recessed portion smoothing method using the putty sheet, whereby work time can be shortened and costs can be reduced. [Solution] This putty sheet 1 is constituted so as to include a flexible putty layer 2 formed from at least one putty material among a synthetic resin emulsion based putty, a gypsum based putty, and a calcium carbonate based putty, and an adhesive layer 3 for pasting the putty layer 2 in such a manner as to cover a recessed portion 40. Then, the present invention comprises pasting this putty sheet 1 in such a manner as to cover the recessed portion 40 in a wall surface, thereafter, coating an overcoat putty from over this putty sheet 1, and sanding to smooth the periphery thereof.
Inventors:
TAJIMA TAKASHI (JP)
Application Number:
PCT/JP2021/027818
Publication Date:
May 19, 2022
Filing Date:
July 28, 2021
Export Citation:
Assignee:
TAJIMA TAKASHI (JP)
International Classes:
E04F13/02; E04F13/08
Foreign References:
| JP3215021U | 2018-02-22 |
Attorney, Agent or Firm:
KURU Toru (JP)
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