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Title:
PYROPHOSPHORIC ACID BATH FOR USE IN COPPER-TIN ALLOY PLATING
Document Type and Number:
WIPO Patent Application WO2004005528
Kind Code:
A3
Abstract:
The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5-2 to 0.1-5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.

Inventors:
URATA KAZUYA (JP)
TACHIBANA KUNIO (JP)
ONIWA NAOYUKI (JP)
TAJIMA MIKIYA (JP)
OGAWA YUKIO (JP)
Application Number:
PCT/JP2003/006262
Publication Date:
April 14, 2005
Filing Date:
May 20, 2003
Export Citation:
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Assignee:
NIHON NEW CHROME CO LTD (JP)
URATA KAZUYA (JP)
TACHIBANA KUNIO (JP)
ONIWA NAOYUKI (JP)
TAJIMA MIKIYA (JP)
OGAWA YUKIO (JP)
International Classes:
C25D3/58; C25D3/56; (IPC1-7): C25D3/58
Foreign References:
EP1146148A22001-10-17
US3945894A1976-03-23
EP1099780A22001-05-16
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09 31 July 1998 (1998-07-31)
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