Title:
QFN PACKAGING STRUCTURE, RADIO FREQUENCY TRANSCEIVING MODULE STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/050705
Kind Code:
A1
Abstract:
The present application relates to the field of packaging, and in particular relates to a QFN packaging structure, a radio frequency transceiving module structure and an electronic device. The QFN packaging structure comprises a substrate, an EPAD soldering area, a chip and QFN package pins. The EPAD soldering area is disposed on a surface of the substrate, and the chip is disposed on the surface of the EPAD soldering area; the QFN package pins surround the EPAD soldering area, and are disposed on the surface of the substrate; the QFN package pins are used to connect to a device outside the QFN packaging structure; the QFN package pins are connected to the chip; the chip is disposed at a non-central position on the surface of the EPAD soldering area; a radio frequency transmitting pin of the chip is connected to a radio frequency transmitting pin of the QFN package pins by means of at least three first bond wires. The radio frequency transmitting pin of the chip is connected to the radio frequency transmitting pin of the QFN package pins by means of at least three first bond wires, so that parasitic capacitance of the first bond wires and the EPAD soldering area are large, thereby enhancing a harmonic wave filtering effect, and reducing external radiation of harmonic waves.
Inventors:
XIE HAO (CN)
Application Number:
PCT/CN2022/117396
Publication Date:
March 14, 2024
Filing Date:
September 06, 2022
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L23/495; H01L23/50
Foreign References:
| US20070158797A1 | 2007-07-12 | |||
| US9252767B1 | 2016-02-02 | |||
| CN210578437U | 2020-05-19 | |||
| CN102709264A | 2012-10-03 | |||
| US20040104456A1 | 2004-06-03 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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