Title:
RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2012/011701
Kind Code:
A2
Abstract:
Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
Inventors:
AN YUN HO (KR)
KIM EUN JIN (KR)
LEE HYUK SOO (KR)
PARK JAE MAN (KR)
CHO IN HEE (KR)
PARK HYUN GYU (KR)
KIM HAE YEON (KR)
KIM EUN JIN (KR)
LEE HYUK SOO (KR)
PARK JAE MAN (KR)
CHO IN HEE (KR)
PARK HYUN GYU (KR)
KIM HAE YEON (KR)
Application Number:
PCT/KR2011/005218
Publication Date:
January 26, 2012
Filing Date:
July 15, 2011
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
AN YUN HO (KR)
KIM EUN JIN (KR)
LEE HYUK SOO (KR)
PARK JAE MAN (KR)
CHO IN HEE (KR)
PARK HYUN GYU (KR)
KIM HAE YEON (KR)
AN YUN HO (KR)
KIM EUN JIN (KR)
LEE HYUK SOO (KR)
PARK JAE MAN (KR)
CHO IN HEE (KR)
PARK HYUN GYU (KR)
KIM HAE YEON (KR)
International Classes:
H05K7/20; H05K1/02
Foreign References:
| KR20080053048A | 2008-06-12 | |||
| KR20100022351A | 2010-03-02 |
Other References:
See references of EP 2596691A4
Attorney, Agent or Firm:
SEO, Kyo Jun (832-41Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
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Claims: