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Title:
RADIATION-CURABLE RESIN COMPOSITION FOR ADHESIVES
Document Type and Number:
WIPO Patent Application WO2003080755
Kind Code:
A3
Abstract:
A radiation-curable resin composition for adhesives comprising (A) a bisphenol-type epoxy (meth)acrylate having a hydroxyl group, (B) a polyfunctional (meth)acrylate having an aliphatic cyclic structure or an aromatic cyclic structure other than the component (A), and (C) a photoinitiator, wherein the content of the component (A) and the content of the component (B) in the composition are respectively 30 wt% or more. The radiation-curable resin composition for adhesives of the present invention exhibits excellent adhesion to silver, silicon compound, and aluminum, superior moisture-heat resistance, and fast curability, especially at the edge of the disk, and therefore is very useful in the manufacture of optical disks in comparison with conventional adhesives.

Inventors:
YOSHIZAWA JUNJI (JP)
TAKAHASHI ATSUYA (JP)
MASE MASAHITO (JP)
KOMIYA ZEN (JP)
Application Number:
PCT/NL2003/000232
Publication Date:
March 25, 2004
Filing Date:
March 27, 2003
Export Citation:
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Assignee:
DSM IP ASSETS BV (NL)
JSR CORP (JP)
JAPAN FINE COATINGS CO LTD (JP)
YOSHIZAWA JUNJI (JP)
TAKAHASHI ATSUYA (JP)
MASE MASAHITO (JP)
KOMIYA ZEN (JP)
International Classes:
C09J4/02; C08F289/00; C08F290/06; C09J4/06; C09J11/00; (IPC1-7): C09J4/06; C08F222/10; C08F290/06; C08F299/02; C09J4/00; G11B7/24
Domestic Patent References:
WO2002039442A22002-05-16
WO1999007757A11999-02-18
Foreign References:
EP0889465A21999-01-07
Other References:
PATENT ABSTRACTS OF JAPAN vol. 012, no. 316 (C - 524) 26 August 1988 (1988-08-26)
PATENT ABSTRACTS OF JAPAN vol. 015, no. 072 (C - 0808) 20 February 1991 (1991-02-20)
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