Title:
RADIATION-CURING ADHESIVE TAPE FOR DICING
Document Type and Number:
WIPO Patent Application WO/2014/050763
Kind Code:
A1
Abstract:
Provided is a radiation-curing adhesive tape for dicing capable of easy pickup without any residual adhesive in the pickup step even for, e.g., a semiconductor chip on which a through electrode is provided. This radiation-curing adhesive tape (1) for dicing has a radiation-curing adhesive layer (3) provided on a substrate sheet (2), wherein the tape is characterized in that Young's modulus after radiation curing/Young's modulus before radiation curing, which is the ratio of the Young's modulus after radiation curing to the Young's modulus before radiation curing, is 1.0-1.8.
Inventors:
OTA SATOSHI (JP)
TAMAGAWA YURI (JP)
YABUKI AKIRA (JP)
HATTORI SATOSHI (JP)
TAMAGAWA YURI (JP)
YABUKI AKIRA (JP)
HATTORI SATOSHI (JP)
Application Number:
PCT/JP2013/075561
Publication Date:
April 03, 2014
Filing Date:
September 20, 2013
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; C09J7/22; C09J7/38; C09J201/00
Foreign References:
| JP2010062541A | 2010-03-18 | |||
| JP2009194303A | 2009-08-27 | |||
| JP2009135377A | 2009-06-18 | |||
| JP2007002173A | 2007-01-11 |
Attorney, Agent or Firm:
MATSUSHITA, MAKOTO (JP)
Matsushita δΊ® (JP)
Matsushita δΊ® (JP)
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