Title:
RADIATION IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/049183
Kind Code:
A1
Abstract:
There is provided a radiation imaging device for inspecting a defect in a printed circuit board in non-contact way by applying radiation to the printed circuit board. It is possible to suppress deterioration of reliability and safety of the device itself due to radiation exposure of a CCD used in the device. A visible ray (5) from a scintillator (4) irradiated by radiation (2) which has transmitted through an object (3) is deflected by an optical prism system (6a) and directed vertically downward. The scintillator (4) and the optical prism system (6a) are surrounded by a radiation protection wall (9), thereby forming “an area exposed to radiation” (10). The visible ray (5) directed vertically downward proceeds outside the radiation protection wall (9) via a visible ray passing opening (6b) of the radiation protection wall (9), reaches a CCD (8) contained in “an area not exposed to radiation or external light” (11) in a lens barrel (7a) detachably attached there, and is converted into an image signal. The lens barrel (7a) containing the CCD (8) can be separately replaced for maintenance from “the area exposed to radiation” (10) containing a member of high cost.
Inventors:
TAKAHASHI AKIHITO (JP)
AKATSUKA GOUBUN (JP)
AKATSUKA GOUBUN (JP)
Application Number:
PCT/JP2005/020135
Publication Date:
May 11, 2006
Filing Date:
November 01, 2005
Export Citation:
Assignee:
MACH TECHNOLOGY CO LTD (JP)
TAKAHASHI AKIHITO (JP)
AKATSUKA GOUBUN (JP)
TAKAHASHI AKIHITO (JP)
AKATSUKA GOUBUN (JP)
International Classes:
G01T1/20; G01N23/04; G01T1/00
Foreign References:
| JPH11231056A | 1999-08-27 | |||
| JPH01238643A | 1989-09-22 | |||
| JP2003509100A | 2003-03-11 |
Attorney, Agent or Firm:
Takino, Hideo (Hiroo SK bldg. 36-13, Ebisu 2-chom, Shibuya-ku Tokyo 13, JP)
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