Title:
RADIATION-SENSITIVE COMPOSITION FOR INSULATION FILM FORMATION USE, RESIN FILM HAVING PATTERN, AND SEMICONDUCTOR CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/210096
Kind Code:
A1
Abstract:
A radiation-sensitive composition for insulation film formation use, which comprises at least one polyfunctional compound (A) selected from a polyfunctional maleimide compound (A-1) and a polyfunctional styryl compound (A-2), a polymer (B) having a group Y that is capable of reacting with the maleimide group in the polyfunctional maleimide compound (A-1) or the styryl group in the polyfunctional styryl compound (A-2), and a photopolymerization initiator (C), in which the polymer (B) has a specific repeating structural unit, and the group Y is represented by formula (Y1).
Inventors:
TATARA RYOUJI (JP)
ITOU HIROKAZU (JP)
OGAWA TAKU (JP)
NAKAFUJI SHIN-YA (JP)
ANABUKI SHOUMA (JP)
ITOU HIROKAZU (JP)
OGAWA TAKU (JP)
NAKAFUJI SHIN-YA (JP)
ANABUKI SHOUMA (JP)
Application Number:
PCT/JP2022/013159
Publication Date:
October 06, 2022
Filing Date:
March 22, 2022
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
B32B27/00; C08F299/02; C08G65/40; C08G73/10; C08L71/00; G03F7/027; G03F7/20
Domestic Patent References:
| WO2020226131A1 | 2020-11-12 | |||
| WO2020226132A1 | 2020-11-12 | |||
| WO2015141618A1 | 2015-09-24 | |||
| WO2020004500A1 | 2020-01-02 |
Foreign References:
| JP2018200470A | 2018-12-20 | |||
| JPH0673003A | 1994-03-15 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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