Title:
RADIATION SENSITIVE COMPOSITION AND PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/046332
Kind Code:
A1
Abstract:
Provided are: a radiation sensitive composition which has excellent sensitivity, storage stability, coatability, developability and safety and is capable of forming a pattern that is suppressed in the occurrence of foreign materials by exposure and development; and a pattern forming method which uses this radiation sensitive composition.
A radiation sensitive composition according to the present invention contains a compound represented by general formula (1). In the formula, R1 represents a hydrogen atom or a hydroxyl group; each of R2 and R3 independently represents a hydrogen atom or a C1-C3 alkyl group; and each of R4 and R5 independently represents a C1-C3 alkyl group.
Inventors:
SHIDA MASARU (JP)
UEMATSU TERUHIRO (JP)
UEMATSU TERUHIRO (JP)
Application Number:
PCT/JP2014/075431
Publication Date:
April 02, 2015
Filing Date:
September 25, 2014
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; G02B5/20
Foreign References:
| JPH1053621A | 1998-02-24 | |||
| JP2009237150A | 2009-10-15 | |||
| JP2011209535A | 2011-10-20 | |||
| JP2008122501A | 2008-05-29 | |||
| JP2013076845A | 2013-04-25 | |||
| JP2009014938A | 2009-01-22 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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