Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/179807
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a radiation-sensitive resin composition with which it is possible to form a resin film that sufficiently inhibits generation of development residues and that exhibits superior elongation properties. The radiation-sensitive resin composition according to the present invention comprises a cyclic olefin polymer (A-1) having a protonic polar group, a cyclic olefin polymer (A-2) having a protonic polar group, a bifunctional epoxy compound (B), and a radiation-sensitive compound (C), wherein the cyclic olefin polymer (A-1) has a weight average molecular weight of not less than 1,000 but less than 10,000; the cyclic olefin polymer (A-2) has a weight average molecular weight of 10,000-100,000; and the contained amount of the cyclic olefin polymer (A-2) accounts for 5-55 mass% of the total contained amount of the cyclic olefin polymer (A-1) and the cyclic olefin polymer (A-2).
Inventors:
FUJIMURA MAKOTO (JP)
Application Number:
PCT/JP2018/003203
Publication Date:
October 04, 2018
Filing Date:
January 31, 2018
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
G03F7/023; C07D303/28; C08G59/22; G03F7/004; G03F7/075
Foreign References:
| JP2015225097A | 2015-12-14 | |||
| JP2006100464A | 2006-04-13 | |||
| JP2002072484A | 2002-03-12 | |||
| JP2016531191A | 2016-10-06 | |||
| US20060177764A1 | 2006-08-10 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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