Title:
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2011/145703
Kind Code:
A1
Abstract:
Disclosed is a radiation-sensitive resin composition which is capable of providing a resist coating film that exhibits excellent drainability on the surface by having a high dynamic contact angle during the exposure in a liquid immersion lithography process, while suppressing occurrence of development defects by being greatly decreased in the dynamic contact angle during the development. The radiation-sensitive resin composition is also capable of reducing the time necessary for change of the dynamic contact angle. Specifically disclosed is a radiation-sensitive resin composition which contains (A) a fluorine-containing polymer that has a structural unit (I) containing a group represented by formula (1), and (B) a radiation-sensitive acid generator.
Inventors:
OSAKI HITOSHI (JP)
ASANO YUSUKE (JP)
SATO MITSUO (JP)
NAGAI TOMOKI (JP)
ASANO YUSUKE (JP)
SATO MITSUO (JP)
NAGAI TOMOKI (JP)
Application Number:
PCT/JP2011/061588
Publication Date:
November 24, 2011
Filing Date:
May 19, 2011
Export Citation:
Assignee:
JSR CORP (JP)
OSAKI HITOSHI (JP)
ASANO YUSUKE (JP)
SATO MITSUO (JP)
NAGAI TOMOKI (JP)
OSAKI HITOSHI (JP)
ASANO YUSUKE (JP)
SATO MITSUO (JP)
NAGAI TOMOKI (JP)
International Classes:
G03F7/039; C08F20/30; G03F7/004; H01L21/027
Foreign References:
| JP2007279664A | 2007-10-25 | |||
| JP2009217253A | 2009-09-24 | |||
| JP2006276458A | 2006-10-12 |
Attorney, Agent or Firm:
AMANO KAZUNORI (JP)
Kazuki Amano (JP)
Kazuki Amano (JP)
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Claims: